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Specialty Wafer Evaluation and Processing

Semiconductor Equipment (Front-end) Resale, Inspection, and Valuation
Equipment List
ID 3471
Manufacturer CDE
Model Resmap 463
Description Four Point Probe
Reference Number
Serial # F01430463F
SECNECI
Manufacture Date
Configuration Features:
300mm FOUP handler;
mini-environment; dual or quad probe changer
Minimum Edge
Exclusion:
1.5mm
(center of probe to edge of film)
Wafer Size:
300mm auto load;
adaptor for 300mm &
200mm open cassette (extra);
manual load any size
Computer System:
Pentium class 1.2 GHz, 512MB RAM, 40GB HD, DVD-RW, FD; 15” monitor; operating system: Windows XP
Max Diameter:
15”
SECS-II Option (need to confirm)
Max Square:
10.5” x 10.5”
POD-ID Option:
RF ID
Typical
Measurement
Time:
1 second per site
Mapping Patterns:
Polar map (align with notch/flat, straddle or follow flat); rectangular map (can choose inside edge exclusion); line scan (diameter, radius or any point to point along diameter, minimum step 0.1mm); user defined template
Typical Wafer
Handling Time:
8 seconds each way
Plots:
Contour (spacing choice, 1/3σ, fixed and auto %), 3D, line, data map, histogram, data sequence, radial and angular distributions; various modes of trend charts available
Typical Notch
Find Time:
5 seconds; standard NF
Data:
All ResMap data files such as maps, etc. can be ported to programs such as Excel® for further analysis.
Maximum
Throughput:
35 wph with notch find
(49 sites)
Facilities
Measurement
Range:
2 mΩ/�� - 5 MΩ/�� ;
may be optimized to 1 mΩ/��
House Vacuum :
Required; >500 mm Hg, on ¼” OD flexible tubing
Repeatability (1σ):
≤ ±0.02% (static or Rs pack);
≤ ±0.1% (dynamic nearby spots, typical)
AC Power:
100V to 240V < 10 KVA
Accuracy:
≤ ±0.5% Using NIST traceable ResCal standards
Size (inches):
width x depth x height
22”w x 44”d x 60”h; stand alone (computer system, etc. enclosed)
Condition/Warranty As-is, where-is
Asking Price $35,000.00
FOB Point Austin Texas
Equipment List

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